Eugenol-based Organic Silicone Epoxy Resin and Its Curing Kinetics

By : Liu Yuan, Dai Jinyue, Wang Sheng, Shen Xiaobin, Sun Liyuan, Jiang Yanhua, Wang Jinggang, Liu Xiaoqing, Zhu Jin, Luo Jun, Chunyan Liu

Page No: 565-578

Abstract
In this paper, a novel bio-based silicone epoxy resin, 1,3-bis(3-(3-methoxy-4-(oxiran-2- ylmethoxy)phenyl)propyl)-1,1,3,3-tetramethyldisiloxane (HMSEEP), was prepared using bio-based monomer, eugenol, as the raw material. Then, 4,4'-diaminophenyl methane (DDM) and two polyetheramine curing agents, D230 and D400, were applied to cure the HMSEEP. The bisphenol A type epoxy resin (DGEBA) was also cured and tested the same as the HMSEEP. The results of 1 H-NMR and FTIR indicated that the bio-based silicone epoxy resin was successfully prepared. Moreover, the curing kinetics of the HMSEEP and DGEBA were investigated by using Kissinger method. HMSEEP had excellent thermal stability and showed no weight loss below 200°C, and the carbon residue of the HMSEEP at 600 ° C was also higher than that of the DGEBA.

Authors :
Liu Yuan, Dai Jinyue, Wang Sheng, Shen Xiaobin, Sun Liyuan, Jiang Yanhua, Wang Jinggang, Liu Xiaoqing And Zhu Jin : Ningbo Institute of Material Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China
Luo Jun : Engineering Research Center for Materials Protection of Wear and Corrosion of Guizhou Province, Guiyang University, Guiyang 550005, China
Chunyan Liu : Department of Chemical Engineering, Chengde Petroleum College, Chengde 067000, Hebei, China